Next-Level Quality
Nikon’s NEXIV VMF-K Series enhances traditional measurement systems by employing an advanced confocal optical system. Designed to improve measurement speed, the VMF-K Series allows users to analyse various materials and components with unprecedented efficiency and precision.
The NEXIV VMF-K Series addresses the challenges posed by complex sample geometries — including high-contrast surfaces and transparent materials — enabling users to capture detailed measurements that were previously challenging to obtain. The system’s integrated 2D and 3D measurement capabilities dramatically reduce inspection times compared to traditional methods, allowing for significantly faster and more comprehensive quality control processes.

Enhanced Optical Measurement Capabilities
The NEXIV VMF-K Series significantly improves optical measurement capabilities, enabling precise 2D and 3D inspections of diverse samples. Its confocal system ensures accurate measurements of high-contrast and transparent materials, enhancing surface and height analyses. This system allows for reliable inspection of complex geometries and fine structures, which is particularly beneficial in semiconductor and miniaturised component manufacturing.

High-Speed Measurement
The NEXIV VMF-K Series combines 2D and height measurements in one device, achieving 1.5 times higher throughput than previous models. Its confocal optical system enables simultaneous 2D and height measurements within the field of view, significantly reducing measurement time without compromising precision.

Versatility Across Multiple Applications
Nikon’s NEXIV VMF-K Series excels in measuring various semiconductor components, including probe cards and bonding wires. This versatility makes it an essential tool for comprehensive semiconductor inspection and quality assurance, streamlining operations by consolidating multiple measurement tasks into one efficient system.

Advanced Support for Semiconductors
Nikon’s NEXIV VMF-K Series standard lineup includes a 45x objective lens to support wafer-level packaging (WLP) measurements. This high-magnification capability allows for precise inspection of ultra-fine structures, which is crucial for maintaining quality control as semiconductor components become smaller.

Long-Dimension Measurement Capability
Nikon’s NEXIV VMF-K Series accurately measures long dimensions that exceed the field of view size while maintaining precision. This feature is essential for semiconductor device measurement, which requires long-dimension positional precision and coordinate system measurement.

Stable Measurement of High-Contrast Items
Using its advanced confocal optical system, Nikon’s NEXIV VMF-K Series provides stable measurements of high-contrast samples. This ensures clear and accurate images, even for samples with significant variations in brightness or reflectivity.

Measurement of Highly Transparent and Thin Samples
Nikon’s NEXIV VMF-K Series accurately measures highly transparent and thin samples, addressing a common challenge in optical measurement systems. This capability extends its applicability to measuring transparent and thin samples, such as metal surface films and semiconductor resists, enhancing its versatility across various measurements.

The NEXIV VMF-K Series combines 2D and 3D optical measurements with 1.5 times higher throughput for probe cards. It has a 45x objective lens and LED confocal light source (30,000-hour lifespan) and supports wafer-level packaging and long-dimension measurements. SEMI S2/S8 compliant, it excels in semiconductor and precision engineering applications.

• NEXIV VMF-K3040
  Strokes (XYZ): 300x400x150mm
• NEXIV VMF-K6555
  Strokes (XYZ): 650x550x150mm

Innovation and Quality in Every Environment
The NEXIV VMF-K Series provides advanced optical measurement for diverse industries. Its confocal system offers precise 2D and 3D measurements for various components, handling high-contrast and transparent samples. With enhanced throughput and high magnification, it supports miniaturisation and complex geometries in modern manufacturing, particularly in the semiconductor and electronics industries.

Advanced Packaging
The NEXIV VMF-K Series combines simultaneous 2D and height analysis within a single field of view, making it ideal for advanced packaging processes. The newly standardised 45x objective lens enables precise measurement of features below 2μm, directly addressing the challenges posed by increasingly complex semiconductor device architectures.

Probe Card Inspection
The NEXIV VMF-K Series delivers a 1.5x improvement in probe card measurement throughput compared to its predecessor. This speed enhancement combines with the system’s ability to maintain stable measurements beyond the field of view, streamlining inspection processes while ensuring comprehensive probe card evaluation accuracy.

Wafer Inspection
The NEXIV VMF-K Series utilises advanced confocal optics to ensure precise inspection of surfaces with varying reflectivity, making it ideal for semiconductor wafer analysis. Its standardised 45x objective lens captures the finest wafer features, while the simultaneous 2D and height measurement capability maximises inspection efficiency within each field of view.

Substrate Production
Optimised for substrate inspection workflows, the NEXIV VMF-K Series achieves stable measurements across challenging materials, including high-contrast and transparent samples. Building on proven confocal technology, the system delivers 1.5x faster scanning speeds than the previous generation while maintaining the precision needed for modern substrate production standards.

• Download our comprehensive Industrial & Portable Metrology Catalogue here.